Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in PCB .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Zirkuitu Inprimatuaren Sarrera
Zirkuitu Inprimatu Normala: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS PCB normalak fabrikatzeko gaitasunak:
| YMS PCB normalak fabrikatzeko gaitasunen ikuspegi orokorra | ||
| Ezaugarria | gaitasunak | |
| Geruza kopurua | 1-60L | |
| Erabilgarri dagoen PCB teknologia normala | 16: 1 itxura erlazioa duen zulo pasagarria | |
| lurperatuta eta itsu bidez | ||
| Hibridoa | Maiztasun handiko materiala, hala nola RO4350B eta FR4 Mix etab. | |
| Abiadura Handiko Materiala, hala nola M7NE eta FR4 Mix etab. | ||
| Materiala | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5.etab |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G etab. | |
| Abiadura handia | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 etab. | |
| Maiztasun handikoa | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 etab. | |
| Beste batzuk | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, zeramikazko etab. | |
| Lodiera | 0,3 mm-8 mm | |
| Gehienezko kobre lodiera | 10 OZ | |
| Gutxieneko lerroaren zabalera eta espazioa | 0,05 mm / 0,05 mm (2 mil / 2 mil) | |
| BGA PITCH | 0,35 mm | |
| Zulatutako neurri mekanikoa | 0,15 mm (6 milia) | |
| Zulo iragankorraren itxura erlazioa | 16 ： 1 | |
| Azalera akabera | HASL, berunik gabeko HASL, ENIG, murgiltze latakoa, OSP, murgiltze zilarra, urrezko hatzarekin, galvanizatutako urrezko gogorra, OSP selektiboa ， ENEPIG.etc. | |
| Bete Aukeraren bidez | Bidea estalita dago eta epoxi eroale edo ez-eroaleaz betetzen da, gero estalita eta estalita (VIPPO) | |
| Kobrea beteta, zilarrez betea | ||
| Izena ematea | ± 4mil | |
| Soldadura Maskara | Berdea, gorria, horia, urdina, zuria, beltza, morea, beltza matea, berde matea, etab. | |
Gustatuko zaizu:
1、Summary of matters needing attention in circuit board welding
4、Zer da taula hutsaren azterketa?
5. Zer da maiztasun handiko PCB diseinua
Lortu informazio gehiago YMS produktuei buruz
