HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Lühike kirjeldus:

HDI trükkplaadid offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

parameetrid

Kihid: 8

Base Material:FR4 High Tg EM827

Paksus: 1,6 ± 0,10 mm

Min.Hole Size：0.15mm

Minimaalne Line Width / Space: 0.10mm / 0.10mm

Minimaalne sisekihi PTH ja joone vaheline kaugus ： 0,2 mm

Suurus: 222mm x 120mm

Aspect Ratio：10.6 : 1

Töötluseks: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Rakendused: Arvuti

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HDI trükkplaat is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board tootmisprotsessi:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Üldiselt tootmisprotsessi HDI plaat on keeruline, mis tuleb lõpule pärast mitu korda tootmise pikka aega. See ei ole ainult kõrge nõuded täpsuse ja kokkutõmbumise kontrolli iga kihi, vaid ka kõrgete standardite materjalid, seadmed, keskkond ja tehniline personal.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB tootmisvõimaluste ülevaade
Tunnusjoon	võimeid
Kihtide arv	4-60L
Saadaval HDI PCB tehnoloogia	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Mis tahes kiht
Paksus	0,3–6 mm
Minimaalne joone laius ja ruum	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Min laserpuuritud suurus	0.075mm (3nil)
Min mehaaniline puuritud suurus	0,15 mm (6 miljonit)
Laseraugu kuvasuhe	0,9: 1
Läbivaava kuvasuhe	16: 1
Pinna viimistlus	HASL, pliivaba HASL, ENIG, keelekümblusplekk, OSP, sukeldushõbe, kuldsõrm, kõvakuldne galvaniseerimine, valikuline OSP ， ENEPIG.etc.
Täitmisvõimaluse kaudu	Läbimõõt plaaditakse ja täidetakse juhtiva või mittejuhtiva epoksüga, seejärel kaetakse ja kaetakse plaatidega
	Vasega täidetud, hõbedaga täidetud
	Laser vaskkattega kinni
Registreerimine	± 4mil
Jootemask	Roheline, punane, kollane, sinine, valge, must, lilla, matt must, matt roheline jne.