HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Mallonga priskribo:

HDI presitaj cirkvitoj offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

parametroj

Tavoloj: 8

Base Material:FR4 High Tg EM827

Dikeco: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Minimuma Linio Larĝeco / Spaco: 0.10mm / 0.10mm

Minimuma Malplenigo inter Interna Tavola PTH kaj Linio ： 0.2mm

Grandeco: 222mm × 120mm

Aspect Ratio：10.6 : 1

Surfaca trakto: enig

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplikoj: Komputila

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produkto Detalo

Oftaj Demandoj

produkto Etikedoj

HDI-PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Estraro produktado procezo:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Entute, la procezo de produktado de HDI telero estas kompleksa, kiu devas esti kompletigita post multaj tempoj de produktado dum longa tempo. Ĝi ne estas nur altaj postuloj por la precizeco kaj kuntiriĝo kontrolo de ĉiu tavolo, sed ankaŭ altaj normoj en materialoj, ekipaĵo, medio kaj teknika dungitaro.

YMS HDI PCB manufacturing capabilities:

Superrigardo pri fabrikado de kapabloj de YMS HDI
Trajto	kapabloj
Tavola Kalkulo	4-60L
Havebla HDI-PCB-Teknologio	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Ajna tavolo
Dikeco	0.3mm-6mm
Minimuma linio Larĝo kaj Spaco	0.05mm / 0.05mm (2mil / 2mil)
BGA-PIKTO	0.35mm
Min lasero Borita Grandeco	0.075mm (3nil)
Min mekanika Borita Grandeco	0.15mm (6mil)
Aspektoproporcio por lasera truo	0.9: 1
Aspektoproporcio por tra truo	16: 1
Surfaca Finiĝo	HASL, Senplumba HASL, ENIG, Mergada Stano, OSP, Mergenta Arĝento, Ora Fingro, Galvanizado de Malmola Oro, Selektema OSP ， ENEPIG.etc.
Tra Pleniga Opcio	La vojo estas tegita kaj plenigita per aŭ konduka aŭ nekondukta epoksio tiam kovrita kaj tegita
	Kupro plenigita, arĝenta plenpleno
	Lasero per kupro tegita fermita
Aliĝo	± 4mil
Solda Masko	Verda, Ruĝa, Flava, Blua, Blanka, Nigra, Purpura, Mata Nigra, Mata verda.etc.