High Tg material PCB 6 Layer High Tg Board| YMS PCB

Kurze Beschreibung:

High TG PCBs have an array of applications, from engines to industrial processes, WiFi boosters, and computer systems. They mitigate the internal damage a machine does to itself when it functions by raising the tolerance of a device to heat, moisture, and chemical corrosion. Not only do they improve functionality, but they also enhance the lifespan of PCBs in general by reducing common issues like short-circuiting. If you are looking to get the best-embedded systems or a high TG Leiterplatten - Hersteller , look no further. You can use YMS technology to design your high TG PCB boards.

Parameter

Layers: 6L High Tg FR4 Material Board Thinkness: 1,6 mm Base Material:EM827 High tg Min. Löcher: 0,2 mm Minimale Linienbreite / Abstand: 0,075 mm / 0,075 mm Mindestabstand zwischen der inneren Schicht PTH und der Linie: 0,2 mm Size：214mm×148mm Seitenverhältnis: 8: 1 Oberflächenbehandlung: ENIG Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω Applications: Consumer electronics

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High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as "Tg", indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Merkmal	Fähigkeiten
Ebenenanzahl	3-60L
Verfügbare Multilayer-PCB-Technologie	Durchgangsloch mit Seitenverhältnis 16: 1
	begraben und blind über
	Hybrid	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Dicke	0,3 mm bis 8 mm
Minimale Linienbreite und Abstand	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA PITCH	0,35 mm
Min. Mechanische Bohrgröße	0,15 mm (6 mil)
Seitenverhältnis für Durchgangsloch	16: 1
Oberflächenfinish	HASL, bleifreies HASL, ENIG, Tauchdose, OSP, Immersionssilber, Goldfinger, Galvanisieren von Hartgold, selektives OSP ， ENEPIG.etc.
Über Fülloption	Die Durchkontaktierung wird plattiert und entweder mit leitendem oder nicht leitendem Epoxid gefüllt, dann abgedeckt und überzogen (VIPPO).
	Kupfer gefüllt, Silber gefüllt
Anmeldung	± 4mil
Lötmaske	Grün, Rot, Gelb, Blau, Weiß, Schwarz, Lila, Mattschwarz, Mattgrün usw.