HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Kort beskrivelse:

HDI printkort offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Parametre

Lag: 8

Base Material:FR4 High Tg EM827

Tykkelse: 1,6 ± 0,10 mm

Min.Hole Size：0.15mm

Bredde Minimum Linje / Space: 0.10mm / 0.10mm

Minimumafstand mellem indvendige lag PTH og linje ： 0,2 mm

Størrelse: 222mm × 120mm

Aspect Ratio：10.6 : 1

Overfladebehandling: Enig

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applikationer: Computer

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HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board produktionsprocessen:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

I det hele produktionsprocessen af HDI plade er kompleks, som skal være afsluttet efter mange gange for produktion i lang tid. Det er ikke kun høje krav til nøjagtighed og svind kontrol af hvert lag, men også høje standarder i materialer, udstyr, miljø og teknisk personale.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB-produktionsfunktionsoversigt
Funktion	kapaciteter
Lagantal	4-60L
Tilgængelig HDI PCB-teknologi	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Ethvert lag
Tykkelse	0,3 mm-6 mm
Minimum linjebredde og mellemrum	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA Pitch	0,35 mm
Min laserboret størrelse	0,075 mm (3 nul)
Min mekanisk boret størrelse	0,15 mm (6mil)
Billedformat for laserhul	0,9: 1
Billedformat for gennemgående hul	16: 1
Overfladebehandling	HASL, Blyfri HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Via udfyldningsmulighed	Via er udpladet og fyldt med enten ledende eller ikke-ledende epoxy, derefter lukket og udpladet
	Kobberfyldt, sølvfyldt
	Laser via kobberbelagt lukket
Registrering	± 4mil
Loddemaske	Grøn, rød, gul, blå, hvid, sort, lilla, mat sort, mat grøn. Osv.