High Tg material PCB 6 Layer High Tg Board| YMS PCB

Kort beskrivelse:

High TG PCBs have an array of applications, from engines to industrial processes, WiFi boosters, and computer systems. They mitigate the internal damage a machine does to itself when it functions by raising the tolerance of a device to heat, moisture, and chemical corrosion. Not only do they improve functionality, but they also enhance the lifespan of PCBs in general by reducing common issues like short-circuiting. If you are looking to get the best-embedded systems or a high TG PCB producent , look no further. You can use YMS technology to design your high TG PCB boards.

Parametre

Layers: 6L High Tg FR4 Material Board Thinkness: 1,6 mm Base Material:EM827 High tg Min. Huller: 0,2 mm Minimum linjebredde / -afstand ： 0,075 mm / 0,075 mm Minimumsafstand mellem det indre lag PTH til linjen ： 0,2 mm Size：214mm×148mm Aspekt Ratio: 8: 1 Overfladebehandling: Enig Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω Applications: Consumer electronics

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High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as "Tg", indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Funktion	kapaciteter
Lagantal	3-60L
Tilgængelig flerlags printkortteknologi	Gennemgående hul med billedformat 16: 1
	begravet og blind via
	Hybrid	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Tykkelse	0,3 mm-8 mm
Minimum linjebredde og mellemrum	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA Pitch	0,35 mm
Min mekanisk boret størrelse	0,15 mm (6mil)
Billedformat for gennemgående hul	16: 1
Overfladebehandling	HASL, Blyfri HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Via udfyldningsmulighed	Via er udpladet og fyldt med enten ledende eller ikke-ledende epoxy, derefter lukket og belagt over (VIPPO)
	Kobberfyldt, sølvfyldt
Registrering	± 4mil
Loddemaske	Grøn, rød, gul, blå, hvid, sort, lilla, mat sort, mat grøn. Osv.