Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in PCB fremstiller .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Introduktion til printkort
Normalt printkort: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS Normal PCB-produktionsfunktioner:
| YMS Oversigt over normale PCB-produktionsfunktioner | ||
| Funktion | kapaciteter | |
| Lagantal | 1-60 l | |
| Tilgængelig Normal PCB-teknologi | Gennemgående hul med billedformat 16: 1 | |
| begravet og blind via | ||
| Hybrid | Højfrekvent materiale som RO4350B og FR4 Mix osv. | |
| Højhastighedsmateriale som M7NE og FR4 Mix osv. | ||
| Materiale | CEM- | CEM-1; CEM-2, CEM-4, CEM-5. osv |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G osv. | |
| Høj hastighed | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 serien, MW4000, MW2000, TU933 osv. | |
| Høj frekvens | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 osv. | |
| Andre | Polyimid, Tk, LCP, BT, C-lag, Fradflex, Omega, ZBC2000, PEEK, PTFE, keramikbaseret osv. | |
| Tykkelse | 0,3 mm-8 mm | |
| Maks. Kobbertykkelse | 10 OZ | |
| Minimum linjebredde og mellemrum | 0,05 mm / 0,05 mm (2 mil / 2 mil) | |
| BGA Pitch | 0,35 mm | |
| Min mekanisk boret størrelse | 0,15 mm (6mil) | |
| Billedformat for gennemgående hul | 16 ： 1 | |
| Overfladebehandling | HASL, Blyfri HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc. | |
| Via udfyldningsmulighed | Via er udpladet og fyldt med enten ledende eller ikke-ledende epoxy, derefter lukket og belagt over (VIPPO) | |
| Kobberfyldt, sølvfyldt | ||
| Registrering | ± 4mil | |
| Loddemaske | Grøn, rød, gul, blå, hvid, sort, lilla, mat sort, mat grøn. Osv. | |
Du kan godt lide:
1 、Summary of matters needing attention in circuit board welding
3 、What is PCB
5. Hvad er højfrekvent PCB-design
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