HDI PCB 12 Layer 2 Step HDI Board | YMS PCB

Kort beskrivelse:

HDI PCB is the short form of high-density interconnect printed circuit board, a kind of printed circuit board manufacturing technology.

Et HDI PCB is a circuit board with a relatively high circuit density that uses micro-blind and buried “via”—or the copper-plated holes in PCBs—technology.

HDI PCB are compact products designed for small-capacity users, as they cost much more than standard PCB.

The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers.

For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism.

You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

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Parametre

Lag: 12

Base Material:FR4 High Tg EM827

Tykkelse ： 1,2 ± 0,1 mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Minimumafstand mellem indvendige lag PTH og linje ： 0,2 mm

Size：101mm×55mm

Aspekt Ratio: 8: 1

Overfladebehandling: Enig

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applikationer: Telekommunikation

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi trin HDI muliggør tilslutning mellem eventuelle lag;

2.Cross lag laser behandling kan forbedre kvalitetsniveauet for flertrins-HDI;

3.Det kombination af HDI og højfrekvente materialer, metal-baserede laminater, FPC og andre særlige laminater og processer vil imødekomme høj densitet og høj frekvens, høj varmeledende eller 3D samling.

YMS HDI PCB-produktionskapacitet :

YMS HDI PCB-produktionsfunktionsoversigt
Funktion	kapaciteter
Lagantal	4-60L
Tilgængelig HDI PCB-teknologi	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Ethvert lag
Tykkelse	0,3 mm-6 mm
Minimum linjebredde og mellemrum	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA Pitch	0,35 mm
Min laserboret størrelse	0,075 mm (3 nul)
Min mekanisk boret størrelse	0,15 mm (6mil)
Billedformat for laserhul	0,9: 1
Billedformat for gennemgående hul	16: 1
Overfladebehandling	HASL, Blyfri HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Via udfyldningsmulighed	Via er udpladet og fyldt med enten ledende eller ikke-ledende epoxy, derefter lukket og udpladet
	Kobberfyldt, sølvfyldt
	Laser via kobberbelagt lukket
Registrering	± 4mil
Loddemaske	Grøn, rød, gul, blå, hvid, sort, lilla, mat sort, mat grøn. Osv.