Competitive Price for Thermoelectric Separation Car Copper Base Pcb - Multilayer PCB buried and blind via Halogen Free VIPPO IST test| YMSPCB – Yongmingsheng

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Competitive Price for Thermoelectric Separation Car Copper Base Pcb - Multilayer PCB buried and blind via Halogen Free VIPPO IST test| YMSPCB – Yongmingsheng Detail:

What is Multilayer PCBs

Multilayer Printed Circuit Board, It is a type of PCB which comes with a combination of single sided PCB and double sided PCB. It features layers more than double sided PCB.

Benefits of Multilayer PCBs (compared to single or double-sided PCBs)

Higher assembly density
Smaller size (considerable savings on space)
Increased flexibility
Easier incorporation controlled impedance features.
EMI shielding through careful placement of power and ground layers.
Reduces the need for interconnection wiring harnesses (reduces overall weight)

Building a Multilayer PCB

Multilayer PCBs are built by joining all the number of layers and materials at high temperature and pressure so as to remove any trapped air between the layers. Resin and adhesive material is used to stick the components and different layers together. You can choose from a number of materials such as exotic ceramic, epoxy glass, or Teflon etc. to build your PCB. The different prepreg and core layers are combined and go through the lamination process taking place at high temperature and pressure that helps to melt the layers together. After that the PCB is cooled down to form a hard and solid board.

YMS Multilayer PCB manufacturing capabilities:

YMS Multilayer PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	3-60L
Available Multilayer PCB Technology	Through hole with Aspect Ratio 16:1
	buried and blind via
	Hybrid	High Frequency Material such as RO4350B and FR4 Mix etc.
		High Speed Material such as M7NE and FR4 Mix etc.
Thickness	0.3mm-8mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
	Copper filled, silver filled
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.

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