HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Breve descrizzione:

Circuiti stampati HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

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Bonifacio: 8

Base Material:FR4 High Tg EM827

PAL: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

L Line minimu / Space: 0.10mm / 0.10mm

Distanza Minima trà PTH di Stratu Internu è Linea ： 0.2mm

Size: 222mm × 120mm

Aspect Ratio：10.6 : 1

malu a superficia: enigma

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Travaux: Computer

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PCB HDI is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board prucessu di pruduzzioni:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

U tuttu, u prucessu di pruduzzioni di a miccia HDI hè cumplicatu, chì ci vole à esse compie, dopu tanti voti di pruduzzione per un bellu pezzu. Hè micca solu altu esigenze di u accuratezza è Battitura lu cuntrollu di tutti li palori, ma dinù alta epuca in materia, vagliatura, ambiente è u persunale di tecnicu.

YMS HDI PCB manufacturing capabilities:

Panoramica di capacità di fabbricazione di PCB YMS HDI
Feature	capacità
Conti di Livelli	4-60L
Dispunibule Tecnulugia PCB HDI	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Ogni stratu
Spessore	0.3mm-6mm
Larghezza minima di linea è Spaziu	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Dimensione minima forata laser	0,075 mm (3nil)
Dimensione minima forata meccanica	0.15mm (6mil)
Ratio d'aspettu per u foru laser	0.9: 1
Ratio d'aspettu per u foru passante	16: 1
Finitura superficiale	HASL, HASL senza piombu, ENIG, Stagnu à immersione, OSP, Argentu à immersione, Dita d'oru, Galvanoplastia Duro Duro, OSP selettivu E ENEPIG.etc.
Via Opzione Fill	A via hè placcata è piena di epossidia cunduttiva o non conduttiva poi tappata è placcata
	Rame pienu, argentu pienu
	Laser via rame chjusu
Scrizzione	± 4mil
Maschera di Saldatura	Verde, Rossu, Giallu, Turchinu, Biancu, Neru, Viulettu, Neru Matteu, verde Matteu ecc.