High Tg material PCB 6 Layer High Tg Board| YMS PCB

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High TG PCBs have an array of applications, from engines to industrial processes, WiFi boosters, and computer systems. They mitigate the internal damage a machine does to itself when it functions by raising the tolerance of a device to heat, moisture, and chemical corrosion. Not only do they improve functionality, but they also enhance the lifespan of PCBs in general by reducing common issues like short-circuiting. If you are looking to get the best-embedded systems or a high TG joca PCB , look no further. You can use YMS technology to design your high TG PCB boards.

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Layers: 6L High Tg FR4 Material Pensamentu di u Cunsigliu: 1.6mm Base Material:EM827 High tg Fori minimi: 0,2 mm Larghezza Minima di Linea / Liquidazione ： 0.075mm / 0.075mm Distanza Minima trà PTH di Stratu Internu à Linea ： 0.2mm Size：214mm×148mm Inquadramentu aspettu: 8: 1 malu a superficia: enigma Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω Applications: Consumer electronics

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High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as "Tg", indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Feature	capacità
Conti di Livelli	3-60L
Tecnulugia PCB Multilayer dispunibule	Foru attraversu cù Proporzione 16: 1
	sipoltu è cecu via
	Ibridu	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Spessore	0,3 mm-8 mm
Larghezza minima di linea è Spaziu	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Dimensione minima forata meccanica	0.15mm (6mil)
Ratio d'aspettu per u foru passante	16: 1
Finitura superficiale	HASL, HASL senza piombu, ENIG, Stagnu à immersione, OSP, Argentu à immersione, Dita d'oru, Galvanoplastia Duro Duro, OSP selettivu E ENEPIG.etc.
Via Opzione Fill	A via hè placcata è piena di epossidia cunduttiva o non conduttiva poi tappata è placcata (VIPPO)
	Rame pienu, argentu pienu
Scrizzione	± 4mil
Maschera di Saldatura	Verde, Rossu, Giallu, Turchinu, Biancu, Neru, Viulettu, Neru Matteu, verde Matteu ecc.