HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Mubo nga paghulagway:

HDI nga giimprinta nga mga circuit board offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

lantugi

Sapaw, mga haklap: 8

Base Material:FR4 High Tg EM827

Gibag-on: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Minimum Line Gilapdon / Space: 0.10mm / 0.10mm

Minimum nga clearance taliwala sa Inner Layer PTH ug Line ： 0.2mm

Size: 222mm × 120mm

Aspect Ratio：10.6 : 1

Nawong pagtambal: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aplikasyon: Computer

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FAQ

Mga Tags sa Produkto

Ang HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board produksyon nga proseso:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Sa bug-os nga, ang produksyon nga proseso sa HDI plate mao ang komplikado, nga kinahanglan nga mahuman human sa daghang mga higayon sa produksyon alang sa usa ka hataas nga panahon. Kini dili lamang sa taas nga mga kinahanglanon alang sa tukma ug sa shrinkage kontrol sa matag layer, apan usab sa taas nga mga sumbanan sa mga materyales, mga ekipo, kinaiyahan ug teknikal nga personnel.

YMS HDI PCB manufacturing capabilities:

Ang kinatibuk-an sa kaarang sa paghimo sa YMS HDI PCB
Dagway	mga kaarang
Ihap sa Layer	4-60L
Magamit nga Teknolohiya sa HDI PCB	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Bisan unsang layer
Kabag-on	0.3mm-6mm
Minimum nga gilapdon ug Luna sa linya	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min laser nga Gidak-on nga Gibansay	0.075mm (3nil)
Min mekanikal nga Gidak-on nga Gibansay	0.15mm (6mil)
Aspect Ratio alang sa lungag sa laser	0.9: 1
Aspect Ratio alang pinaagi sa lungag	16: 1
Pagtapos sa Ibabaw	NANGHIMO, libre nga Nangulo HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG.etc.
Pinaagi sa Pagpili sa Pagpuno	Ang via gipalutan ug gipuno sa bisan unsang conductive o non-conductive epoxy pagkahuman gitak-opan ug gipalutan
	Puno sa tanso, napuno ang pilak
	Ang laser pinaagi sa tumbaga nga plato sirado
Pagrehistro	± 4mil
Maskara sa Solder	Berde, Pula, Dilaw, Asul, Puti, Itom, Lila, Matte nga Itum, Matte nga berde, ug uban pa.