Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in pagtan-aw sa mga .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Naimprinta nga Pasiuna sa Circuit Board
Normal nga Printed Circuit Board: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS Normal nga kaarang sa paghimo sa PCB:
YMS Kasagaran nga kinatibuk-ang pagtan-aw sa mga kaarang sa PCB | ||
Dagway | mga kaarang | |
Ihap sa Layer | 1-60L | |
Magamit nga Normal nga Teknolohiya sa PCB | Pinaagi sa lungag nga adunay Aspect Ratio 16: 1 | |
gilubong ug buta pinaagi | ||
Hybrid | Taas nga Materyal sa Frequency sama sa RO4350B ug FR4 Mix etc. | |
Mga Materyal nga High Speed sama sa M7NE ug FR4 Mix etc. | ||
Materyal nga | CEM- | CEM-1; CEM-2 ; CEM-4 ; CEM-5.etc |
FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G etc. | |
Hataas Speed | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 etc. | |
Taas nga Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 ug uban pa. | |
Ang uban pa | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, nakabase sa ceramic ug uban pa. | |
Kabag-on | 0.3mm-8mm | |
Max.copper Kapal | 10OZ | |
Minimum nga gilapdon ug Luna sa linya | 0.05mm / 0.05mm (2mil / 2mil) | |
BGA PITCH | 0.35mm | |
Min mekanikal nga Gidak-on nga Gibansay | 0.15mm (6mil) | |
Aspect Ratio alang pinaagi sa lungag | 16 : 1 | |
Pagtapos sa Ibabaw | NANGHIMO, libre nga Nangulo HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG.etc. | |
Pinaagi sa Pagpili sa Pagpuno | Ang via gipalutan ug gipuno sa conductive o non-conductive epoxy pagkahuman gitak-opan ug gipalutan (VIPPO) | |
Puno sa tanso, napuno ang pilak | ||
Pagrehistro | ± 4mil | |
Maskara sa Solder | Berde, Pula, Dilaw, Asul, Puti, Itom, Lila, Matte nga Itum, Matte nga berde, ug uban pa. |
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