High Tg material PCB 6 Layer High Tg Board| YMS PCB

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High TG PCBs have an array of applications, from engines to industrial processes, WiFi boosters, and computer systems. They mitigate the internal damage a machine does to itself when it functions by raising the tolerance of a device to heat, moisture, and chemical corrosion. Not only do they improve functionality, but they also enhance the lifespan of PCBs in general by reducing common issues like short-circuiting. If you are looking to get the best-embedded systems or a high TG fabricant de PCB , look no further. You can use YMS technology to design your high TG PCB boards.

paràmetres

Layers: 6L High Tg FR4 Material Pensament del tauler: 1,6 mm Base Material:EM827 High tg Forats mínims: 0,2 mm Amplada / Distància mínima de línia ： 0,075 mm / 0,075 mm Distància mínima entre la capa interior PTH i la línia ： 0,2 mm Size：214mm×148mm Relació d'aspecte: 8: 1 Tractament de la superfície: ENIG Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω Applications: Consumer electronics

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High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as "Tg", indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Funció	capacitats
Recompte de capes	3-60L
Tecnologia de PCB multicapa disponible	Forat passant amb una relació d'aspecte 16: 1
	enterrat i cec via
	Híbrid	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Gruix	0,3 mm-8 mm
Amplada i espai mínim de la línia	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA PITCH	0,35 mm
Mida mínima perforada mecànica	0,15 mm (6 mil)
Relació d'aspecte per al forat passant	16: 1
Acabat superficial	HASL, HASL sense plom, ENIG, llauna d’immersió, OSP, plata d’immersió, dit d’or, daurat galvanitzat, OSP selectiu ， ENEPIG.etc.
Opció d'emplenament mitjançant	La via es xapa i s’omple amb epoxi conductor o no conductor, després es tapa i es xapa (VIPPO)
	Farcit de coure, farcit de plata
Inscripció	± 4mil
Màscara de soldadura	Verd, vermell, groc, blau, blanc, negre, morat, negre mat, verd mat, etc.