Best-Selling China 6-Layer High Tg Thick Copper Immersion Gold Board No Solder Mask HDI PCB
We believe that long expression partnership is actually a result of top quality, worth added services, prosperous experience and personal contact for Best-Selling China 6-Layer High Tg Thick Copper Immersion Gold Board No Solder Mask HDI PCB, Welcome all over the world consumers to get in touch with us for enterprise and long-term cooperation. We are going to be your reliable partner and supplier.
We believe that long expression partnership is actually a result of top quality, worth added services, prosperous experience and personal contact for China Rigid Board, Pcb Design, With the best technological support, we have now tailored our website for the best user experience and kept in mind your ease of shopping. we ensure that the best reaches you at your doorstep, in the shortest possible time and with the help of our efficient logistical partners i.e DHL and UPS. We promise quality, living by the motto of promising only what we can deliver.
High-TG PCB Advanced Circuits Specification
The glass transition temperature of PCB, referred to as “Tg”, indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.
Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.
YMS High Tg PCB manufacturing capabilities:
|
YMS High Tg PCB manufacturing capabilities overview |
||
| Feature | capabilities | |
| Layer Count | 3-60L | |
| Available Multilayer PCB Technology | Through hole with Aspect Ratio 16:1 | |
| buried and blind via | ||
| Hybrid | High Frequency Material such as RO4350B and FR4 TG 180°Mix etc. | |
| High Speed Material such as M7NE and FR4 TG 180°Mix etc. | ||
| Thickness | 0.3mm-8mm | |
| Minimum line Width and Space | 0.05mm/0.05mm(2mil/2mil) | |
| BGA PITCH | 0.35mm | |
| Min mechanical Drilled Size | 0.15mm(6mil) | |
| Aspect Ratio for through hole | 16:1 | |
| Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc. | |
| Via Fill Option | The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO) | |
| Copper filled, silver filled | ||
| Registration | ±4mil | |
| Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. | |
