Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in ፒሲቢ የማምረት .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
የታተመ የወረዳ ቦርድ መግቢያ
መደበኛ የታተመ የወረዳ ሰሌዳ: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS መደበኛ PCB የማምረቻ ችሎታዎች
| የ YMS መደበኛ PCB የማምረት ችሎታዎች አጠቃላይ እይታ | ||
| ባህሪ | ችሎታዎች | |
| የንብርብር ቆጠራ | ከ1600 ኤል | |
| ይገኛል መደበኛ PCB ቴክኖሎጂ | ከፕሬስ ሬሾ 16: 1 ጋር ባለው ቀዳዳ በኩል | |
| የተቀበረ እና ዕውር በኩል | ||
| ድቅል | እንደ RO4350B እና FR4 Mix ወዘተ ያሉ ከፍተኛ ድግግሞሽ ነገሮች | |
| እንደ M7NE እና FR4 ድብልቅ ወዘተ ያሉ ከፍተኛ ፍጥነት ያላቸው ቁሳቁሶች | ||
| ቁሳቁስ | ሲኤም- | CEM-1 ፣ CEM-2 ； CEM-4 ； CEM-5.etc |
| FR4 እ.ኤ.አ. | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G ወዘተ | |
| ከፍተኛ ፍጥነት | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 ወዘተ | |
| ከፍተኛ ድግግሞሽ | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 ወዘተ | |
| ሌሎች | ፖሊላይድ ፣ ቲኬ ፣ ኤል.ሲ.ፒ. ፣ ቢቲ ፣ ሲ-ፕሊ ፣ ፍራድፍሌክስ ፣ ኦሜጋ ፣ ZBC2000 ፣ ፒኢክ ፣ ፒቲኤ ፣ ሴራሚክ ላይ የተመሠረተ | |
| ውፍረት | 0.3 ሚሜ -8 ሚሜ | |
| Max.copper ውፍረት | 10OZ | |
| አነስተኛ መስመር ስፋት እና ክፍተት | 0.05 ሚሜ / 0.05 ሚሜ (2 ሚሊል / 2 ሚሜ) | |
| ቢ.ጂ. ፒች | 0.35 ሚሜ | |
| ደቂቃ ሜካኒካዊ ቁፋሮ መጠን | 0.15 ሚሜ (6 ሚሜ) | |
| ቀዳዳ በኩል ለማግኘት ምጥጥነ ገጽታ | 16 ： 1 | |
| የገጽ ማጠናቀቂያ | HASL ፣ መሪ ነፃ HASL ፣ ENIG ፣ ማጥመጃ ቲን ፣ ኦኤስፒ ፣ ጠላቂ ብር ፣ የወርቅ ጣት ፣ ኤሌክትሪክ ሀርድ ወርቅን በኤሌክትሪክ መመንጨት ፣ መራጭ OSP ， ENEPIG.etc. | |
| በአማራጭ መሙላት በኩል | መተላለፊያው ተሞልቶ በሚሠራው ወይም በማያስተላልፍ ኢፖክ ተሞልቶ ከዚያ ተሸፍኖ ተሸፍኗል (ቪአይፒኦ) | |
| መዳብ ተሞልቶ ፣ ብር ተሞልቷል | ||
| ምዝገባ | ± 4 ሚል | |
| የሶልደር ማስክ | አረንጓዴ ፣ ቀይ ፣ ቢጫ ፣ ሰማያዊ ፣ ነጭ ፣ ጥቁር ፣ ሐምራዊ ፣ ደብዛዛ ጥቁር ፣ አረንጓዴ አረንጓዴ ወዘተ. | |
መውደድ ይችላሉ
1. Summary of matters needing attention in circuit board welding
3. What is PCB
ስለ YMS ምርቶች የበለጠ ይወቁ
