High Tg PCB Advanced PCB Manufacturing| YMS PCB
How do I classify high-TG materials?
Material | TG | MOT |
FR4-standard-TG | 130°C | 110°C |
FR4-mittel-TG | 150°C | 130°C |
FR4-hoch-TG | 170°C | 150°C |
Polyimid-Super-hoch-TG-Material | 250°C | 230°C |
ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.
You may apply the following values:
Material type | Typical „TG“ |
CEM1 | 110-130°C |
FR4 | 120-180°C |
PTFE | 200-260°C |
Ceramic | 200-300°C |
Polyimide | 200-350°C |
YMS High Tg PCB manufacturing capabilities:
YMS High Tg PCB manufacturing capabilities overview |
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Feature | capabilities | |
Layer Count | 3-60L | |
Available Multilayer PCB Technology | Through hole with Aspect Ratio 16:1 | |
buried and blind via | ||
Hybrid | High Frequency Material such as RO4350B and FR4 TG 180°Mix etc. | |
High Speed Material such as M7NE and FR4 TG 180°Mix etc. | ||
Thickness | 0.3mm-8mm | |
Minimum line Width and Space | 0.05mm/0.05mm(2mil/2mil) | |
BGA PITCH | 0.35mm | |
Min mechanical Drilled Size | 0.15mm(6mil) | |
Aspect Ratio for through hole | 16:1 | |
Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc. | |
Via Fill Option | The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO) | |
Copper filled, silver filled | ||
Registration | ±4mil | |
Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. |
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