Flex Printed Circuit 2Layer | YMSPCB
Characteristics of FPC
1. Free bending, folding and winding, free movement and expansion in 3D space.
2. Good heat dissipation performance, using FPC to reduce the volume.
3. Realize lightweight miniaturization and thinness, so as to achieve the integration of component device and wire connection.
Learn more about YMS products
Write your message here and send it to us