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100% Original Factory China High Quality Fr-4 PCB Manufacturer

Short Description:

Parameters

Layers:2

Base Material:S1170

Copper Inner/Outer Layer:4OZ

Thickness:2.1mm

SolderMask: Black

Surface treatment:Lead free Hasl

Crafts

Countersink

Copper Inner/Outer Layer:4OZ

Applications:Automobile


Product Detail

Product Tags

Our enterprise insists all along the quality policy of "product high-quality is base of organization survival; customer gratification will be the staring point and ending of an company; persistent improvement is eternal pursuit of staff" and also the consistent purpose of "reputation very first, purchaser first" for 100% Original Factory China High Quality Fr-4 PCB Manufacturer, In a word, when you choose us, you choose a ideal existence. Welcome to visit our factory and welcome your get! For even further inquiries, remember to usually do not hesitate to make contact with us.
Our enterprise insists all along the quality policy of "product high-quality is base of organization survival; customer gratification will be the staring point and ending of an company; persistent improvement is eternal pursuit of staff" and also the consistent purpose of "reputation very first, purchaser first" for China PCB Board, Double Side PCB, Selling our products and solutions causes no risks and brings high returns to your company instead. It is our consistent pursuit to create value for clients. Our company is looking for agents sincerely. What are you waiting for? Come and join us. Now or never.
Thick copper plate basic production process:

A、The inner core plate is obtained by cutting materials, and the inner circuit is made on each inner core plate respectively through the processing of inner graph and etching. A number of copper pads are interleaved on the edge of the plate in the open area of each inner core plate to make each inner core plate.

B、The inner layer and outer layer of copper foil are pressed together by semi-curing sheet to make multi-layer production plate.

C、According to the existing technology, the thick copper plate is prepared by the post-treatment of the multilayer production plate.

 





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